Measurements of three epoxies at cryogenic temperatures

Document #:

LARTPC-doc-249-v1

Document type:

Publication

Submitted by:

David Finley

Updated by:

David Finley

Document Created:

07 Feb 2007, 14:08

Contents Revised:

07 Feb 2007, 14:08

Metadata Revised:

07 Feb 2007, 14:08

Abstract:

Materials testing of an adhesive for bonding Silicon to a substrate is presented. Test results include Young's Modulus, Poisson's Ratio, and the coefficient of thermal expansion at temperatures ranging from room temperature to 100 K. Data for 3 epoxies (Tra-Con F113, Epotek 301-2, Hyson 9361) are presented.

Files in Document:

• TM-2366 on Epoxies for SNAP (cold temperatures) (fermilab-tm-2366-a.pdf, 1.3 MB)

Topics:

• Mechanics:References

Authors:

• David Finley
• Author OTHER