LArTPC Document 249-v1

Measurements of three epoxies at cryogenic temperatures

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David Finley
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David Finley
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07 Feb 2007, 14:08
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07 Feb 2007, 14:08
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07 Feb 2007, 14:08
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Materials testing of an adhesive for bonding Silicon to a substrate is presented. Test results include Young's Modulus, Poisson's Ratio, and the coefficient of thermal expansion at temperatures ranging from room temperature to 100 K. Data for 3 epoxies (Tra-Con F113, Epotek 301-2, Hyson 9361) are presented.
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