LArTPC Document 579-v1

SS-G10 bonding for cryo use

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Hans Jostlein
Updated by:
Hans Jostlein
Document Created:
07 May 2010, 16:25
Contents Revised:
07 May 2010, 16:25
Metadata Revised:
07 May 2010, 16:25
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Liquid Argon Time Protection Chambers may require bonding stainless steel items (e.g. structural members) to G10 (fiberglass epoxy) items such as circuit board.
We have calculated the stress on cool down, and cold-shocked several thin and thick samples.
We find that the resulting stresses are well within the epoxy shear stress limits.
The glue stresses are more difficult to assess.
We offer simple steps to reduce the risk of spallation even further.
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