LArTPC Document 607-v1

Wire holding tests with solder only

Document #:
LARTPC-doc-607-v1
Document type:
Note
Submitted by:
Hans Jostlein
Updated by:
Hans Jostlein
Document Created:
30 Aug 2010, 11:35
Contents Revised:
30 Aug 2010, 11:35
Metadata Revised:
30 Aug 2010, 11:35
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  • Public document
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Abstract:
We tested the wire holding power of solder alone. We find that nearly all solder joints fail to hold the tension.
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Keywords:
TPC wire solder
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