Wire holding tests with solder only

Document #:

LARTPC-doc-607-v1

Document type:

Note

Submitted by:

Hans Jostlein

Updated by:

Hans Jostlein

Document Created:

30 Aug 2010, 11:35

Contents Revised:

30 Aug 2010, 11:35

Metadata Revised:

30 Aug 2010, 11:35

Abstract:

We tested the wire holding power of solder alone. We find that nearly all solder joints fail to hold the tension.

Files in Document:

• Wire Solder Tests Solano 2008 .pdf (257.5 kB)

Topics:

• Mechanics:Long Wire Test
• Electrics and DAQ:Wires
• Mechanics:Cellular Design
• Electrics and DAQ:Detectors

Authors:

• Hans Jostlein

Keywords:

TPC wire solder